Product Introduction
Planar Target Bonding refers to the technology that securely bonds the target blank (coating material) to the backing plate through a specific process to form a planar target assembly, widely used in the physical vapor deposition (PVD) coating field.
The bonding process directly affects the lifespan of the target, deposited film uniformity, and equipment stability. A good bonding solution ensures the target remains concentric and stable during high-speed rotation, preventing water or gas leakage, ensuring stable electrical contact, and resulting films with superior unifromity.
Outstanding Characteristics of Planar Target Bonding
Ensures uniform consumption of the target during prolonged sputtering, extending its service life;
Improves the uniformity of film thickness and composition, reducing scrap rate;
Quick replacement, short downtime, and improved production line utilization rate;
Reliable sealing to prevent water cooling leaks, avoiding equipment downtime.
Technical Characteristics
Bonding Service
Provide Backing Plate Bonding Service to Customers
Application Fields
Cu targets
Znsn target
Si target
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