Product Introduction
Copper (Cu) is a high-conductivity, thermally efficient transition metal essential for advanced thin-film applications. Typically supplied as high-purity ingots, pellets, or chunks, copper is optimized for vacuum deposition, electron-beam (e-beam) evaporation, and magnetron sputtering. The resulting thin films are characterized by high density, homogeneity, and superior interfacial adhesion, significantly optimizing the electrical, thermal, and structural stability of integrated devices.
Outstanding Properties of Copper
High Purity
Purity up to 99.9%–99.99%, with low impurity content, ensuring stable and reliable film performance.
Excellent Conductivity
High electrical conductivity, making it suitable for the production of conductive films, electrodes, and interconnect layers.
Good Thermal Conductivity
High thermal conductivity, ideal for electronic device films requiring heat dissipation.
Excellent Ductility
Forms uniform, dense films on various substrates with strong adhesion.
Widespread Applications of Copper
Semiconductor Manufacturing
Used as interconnect layers, conductive films, electrodes, and contact layers, widely applied in chip, circuit board, and packaging processes.
Optical Device Manufacturing
Used in reflective films, optical filters, and functional coatings to enhance optical performance.
Photovoltaic Industry
Applied in functional films in solar cells, lithium batteries, and fuel cells to improve energy efficiency and stability.
Decorative and Protective Coatings
Used in consumer electronics housings, architectural decorations, and crafts to form coatings that are both decorative and protective.
Technical Characteristics
Purity
99.99%-99.999%
Application Fields
Semiconductor Manufacturing
Optical Device Manufacturing
Photovoltaic Industry
Decorative and Protective Coatings
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