Product Introduction
Silver termination paste is a foundational material for the formation of external inductor electrodes. Formulated from high-purity silver powder, glass frit, and a specialized organic vehicle, it is applied via precision dipping or screen-printing methodologies. Following low-temperature sintering, it develops a highly densified electrode layer that ensures a robust interface between internal coils and external circuitry, providing the necessary resilience for subsequent Ni/Sn electroplating processes.
Core Advantages
● High Conductivity
High silver content (typically 80%-90%) with conductivity up to 10? S/cm or higher, ensuring low resistance and minimal signal loss.
● Fine Printing Adaptability
The paste's fineness can be controlled to ≤8μm, supporting 30μm-level line printing, meeting the high-precision multi-layer structure requirements.
● Excellent Co-firing Compatibility
Matches the shrinkage rate of ferrite dielectric materials, avoiding cracking or delamination during sintering and enhancing product reliability.
● Environmentally Friendly and Safe
Complies with lead-free and cadmium-free environmental standards, suitable for export electronic products.
Application Areas
Mainly used for the internal electrode manufacturing of multi-layer chip inductors (MLCI), high-frequency inductors, and magnetic beads. It is widely applied in signal processing and power conversion modules in high-frequency circuits such as smartphones, communication base stations, and automotive electronics.
Technical Specifications
Technical Characteristics
Silver Content (wt.%):
80~90
Viscosity (Pa·S):
150~220
Fineness (μm):
≤8
Printing Accuracy:(μm)
30~120
Shrinkage Rate (%):
15~18
Application Fields
Ceramic Capacitors
Multi-layer Chip Inductors
Magnetic Bead
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